based on a longer experience now BFK-Services is able to support users who intend to apply the thin film technology. Advantages of the thin film technology are caused by the high structure resolution and in the special material properties of polyimide as dielectricum (thermal stable, highly flexible, biologically accommodating)

here just a short description of the process flow, for any single project a extensive analysis and consulting is recommended (contact us, here you find a visualization of the process, which we have created):

Coating a proprietary release layer onto standard glas wafers and sealing with a first coat of polyimide. Several interconnect layers are added using lithographic processes (sequential construction!) . The final layer is finished with a bondable/solderable metallization such as Nickel/Gold.

Here the characteristic values of the process (may vary caused by the used equipment):

- dielectric thickness (polyimide):        5-10 µm
- copper thickness:                             2-10 µm
- min. line / space:                   8/8 µm,          standard: 10/10 µm
- min. via diameter:                   10 µm
- min. via-pad-diameter:             20 µm
- finishing:                               Ni 1-2 µm, Au 0,5-2µm
- max. layer count:                   5